| 000 | 03216nam a22004935i 4500 | ||
|---|---|---|---|
| 001 | 978-3-319-75769-8 | ||
| 003 | DE-He213 | ||
| 005 | 20220801214037.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 180312s2018 sz | s |||| 0|eng d | ||
| 020 |
_a9783319757698 _9978-3-319-75769-8 |
||
| 024 | 7 |
_a10.1007/978-3-319-75769-8 _2doi |
|
| 050 | 4 | _aTK7867-7867.5 | |
| 072 | 7 |
_aTJFC _2bicssc |
|
| 072 | 7 |
_aTEC008010 _2bisacsh |
|
| 072 | 7 |
_aTJFC _2thema |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 100 | 1 |
_aYazdani, Farhang. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _935964 |
|
| 245 | 1 | 0 |
_aFoundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach _h[electronic resource] / _cby Farhang Yazdani. |
| 250 | _a1st ed. 2018. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2018. |
|
| 300 |
_aX, 177 p. 155 illus., 152 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aIntroduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design. | |
| 520 | _aThis book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience. | ||
| 650 | 0 |
_aElectronic circuits. _919581 |
|
| 650 | 0 |
_aElectronics. _93425 |
|
| 650 | 1 | 4 |
_aElectronic Circuits and Systems. _935965 |
| 650 | 2 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 710 | 2 |
_aSpringerLink (Online service) _935966 |
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| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319757674 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319757681 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783030093235 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-75769-8 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c75894 _d75894 |
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