| 000 | 03549nam a22005295i 4500 | ||
|---|---|---|---|
| 001 | 978-981-10-8884-1 | ||
| 003 | DE-He213 | ||
| 005 | 20220801214314.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 180405s2018 si | s |||| 0|eng d | ||
| 020 |
_a9789811088841 _9978-981-10-8884-1 |
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_a10.1007/978-981-10-8884-1 _2doi |
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_a621.3815 _223 |
| 100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _937581 |
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| 245 | 1 | 0 |
_aFan-Out Wafer-Level Packaging _h[electronic resource] / _cby John H. Lau. |
| 250 | _a1st ed. 2018. | ||
| 264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2018. |
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| 300 |
_aXX, 303 p. 278 illus., 226 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aPatent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer-Level Packaging vs. FOWLP -- Embedded Chip Packaging -- FOWLP: Chip-First and Die Face-Down -- FOWLP: Chip-First and Die Face-Up -- FOWLP: Chip-Last or RDL-First -- FOWLP: PoP with FOWLP -- Fan-Out Panel-Level Packaging (FOPLP) -- 3D Integration -- Heterogeneous Integration. | |
| 520 | _aThis comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP. | ||
| 650 | 0 |
_aElectronic circuits. _919581 |
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| 650 | 0 |
_aMicrotechnology. _928219 |
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| 650 | 0 |
_aMicroelectromechanical systems. _96063 |
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| 650 | 0 |
_aOptical materials. _97729 |
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| 650 | 1 | 4 |
_aElectronic Circuits and Systems. _937582 |
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_aMicrosystems and MEMS. _937583 |
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_aOptical Materials. _97729 |
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| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-981-10-8884-1 |
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| 912 | _aZDB-2-SXE | ||
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