| 000 | 02952nam a22005775i 4500 | ||
|---|---|---|---|
| 001 | 978-981-13-3627-0 | ||
| 003 | DE-He213 | ||
| 005 | 20220801214337.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 190423s2019 si | s |||| 0|eng d | ||
| 020 |
_a9789811336270 _9978-981-13-3627-0 |
||
| 024 | 7 |
_a10.1007/978-981-13-3627-0 _2doi |
|
| 050 | 4 | _aTK7800-8360 | |
| 072 | 7 |
_aTJF _2bicssc |
|
| 072 | 7 |
_aTEC008000 _2bisacsh |
|
| 072 | 7 |
_aTJF _2thema |
|
| 082 | 0 | 4 |
_a621.381 _223 |
| 100 | 1 |
_aHuang, YongAn. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _937802 |
|
| 245 | 1 | 0 |
_aModeling and Application of Flexible Electronics Packaging _h[electronic resource] / _cby YongAn Huang, Zhouping Yin, Xiaodong Wan. |
| 250 | _a1st ed. 2019. | ||
| 264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2019. |
|
| 300 |
_aXVII, 287 p. _bonline resource. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
||
| 347 |
_atext file _bPDF _2rda |
||
| 505 | 0 | _aAdvanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on. | |
| 520 | _aThis book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics. | ||
| 650 | 0 |
_aElectronics. _93425 |
|
| 650 | 0 |
_aOptical materials. _97729 |
|
| 650 | 0 |
_aManufactures. _931642 |
|
| 650 | 0 |
_aMechanics, Applied. _93253 |
|
| 650 | 0 |
_aComputer simulation. _95106 |
|
| 650 | 1 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 650 | 2 | 4 |
_aOptical Materials. _97729 |
| 650 | 2 | 4 |
_aMachines, Tools, Processes. _931645 |
| 650 | 2 | 4 |
_aEngineering Mechanics. _931830 |
| 650 | 2 | 4 |
_aComputer Modelling. _937803 |
| 700 | 1 |
_aYin, Zhouping. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _937804 |
|
| 700 | 1 |
_aWan, Xiaodong. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _937805 |
|
| 710 | 2 |
_aSpringerLink (Online service) _937806 |
|
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811336263 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811336287 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-981-13-3627-0 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c76243 _d76243 |
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