000 03717nam a22006255i 4500
001 978-3-030-20776-2
003 DE-He213
005 20220801214513.0
007 cr nn 008mamaa
008 190708s2020 sz | s |||| 0|eng d
020 _a9783030207762
_9978-3-030-20776-2
024 7 _a10.1007/978-3-030-20776-2
_2doi
050 4 _aTJ265
050 4 _aTP156.M3
072 7 _aTGMB
_2bicssc
072 7 _aSCI065000
_2bisacsh
072 7 _aTGMB
_2thema
082 0 4 _a621.4021
_223
100 1 _aSaha, Sujoy Kumar.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_938745
245 1 0 _aInsert Devices and Integral Roughness in Heat Transfer Enhancement
_h[electronic resource] /
_cby Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti.
250 _a1st ed. 2020.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2020.
300 _aIX, 177 p. 194 illus., 99 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringerBriefs in Thermal Engineering and Applied Science,
_x2193-2549
505 0 _aChapter 1. Introduction -- Chapter 2. Twisted-Tape Insert -- Chapter 3. Displaced Enhancement Devices and Wire Coil Inserts -- Chapter 4. Swirl Generators, Extended Surface Insert and Tangential Injection Devices -- Chapter 5. Numerical Simulation of Integral Roughness, Laminar Flow in Tubes with Roughness -- Chapter 6. 2D Roughness, 3D roughness and Roughness Applications -- Chapter 7. Compound Techniques -- Chapter 8. Conclusions.
520 _aThis Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices. .
650 0 _aThermodynamics.
_93554
650 0 _aHeat engineering.
_95144
650 0 _aHeat transfer.
_932329
650 0 _aMass transfer.
_94272
650 0 _aFluid mechanics.
_92810
650 0 _aMaterials—Analysis.
_938746
650 1 4 _aEngineering Thermodynamics, Heat and Mass Transfer.
_932330
650 2 4 _aThermodynamics.
_93554
650 2 4 _aEngineering Fluid Dynamics.
_938747
650 2 4 _aCharacterization and Analytical Technique.
_938748
700 1 _aRanjan, Hrishiraj.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_938749
700 1 _aEmani, Madhu Sruthi.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_938750
700 1 _aBharti, Anand Kumar.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_938751
710 2 _aSpringerLink (Online service)
_938752
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783030207755
776 0 8 _iPrinted edition:
_z9783030207779
830 0 _aSpringerBriefs in Thermal Engineering and Applied Science,
_x2193-2549
_938753
856 4 0 _uhttps://doi.org/10.1007/978-3-030-20776-2
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cEBK
999 _c76417
_d76417