000 | 03368nam a22005175i 4500 | ||
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001 | 978-3-030-20051-0 | ||
003 | DE-He213 | ||
005 | 20220801214745.0 | ||
007 | cr nn 008mamaa | ||
008 | 190612s2020 sz | s |||| 0|eng d | ||
020 |
_a9783030200510 _9978-3-030-20051-0 |
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024 | 7 |
_a10.1007/978-3-030-20051-0 _2doi |
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050 | 4 | _aTK7867-7867.5 | |
072 | 7 |
_aTJFC _2bicssc |
|
072 | 7 |
_aTEC008010 _2bisacsh |
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072 | 7 |
_aTJFC _2thema |
|
082 | 0 | 4 |
_a621.3815 _223 |
100 | 1 |
_aGuo, Xinfei. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _940256 |
|
245 | 1 | 0 |
_aCircadian Rhythms for Future Resilient Electronic Systems _h[electronic resource] : _bAccelerated Active Self-Healing for Integrated Circuits / _cby Xinfei Guo, Mircea R. Stan. |
250 | _a1st ed. 2020. | ||
264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2020. |
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300 |
_aXIX, 208 p. 136 illus., 134 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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505 | 0 | _aIntroduction to Wearout -- Accelerated Self-Healing Techniques for BTI Wearout -- Accelerating and Activating Recovery for EM Wearout -- Circuit Techniques for Accelerated and Active Recovery -- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience -- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications -- Future Directions in Self-Healing. | |
520 | _aThis book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT. | ||
650 | 0 |
_aElectronic circuits. _919581 |
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650 | 0 |
_aMicroprocessors. _940257 |
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650 | 0 |
_aComputer architecture. _93513 |
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650 | 1 | 4 |
_aElectronic Circuits and Systems. _940258 |
650 | 2 | 4 |
_aProcessor Architectures. _940259 |
700 | 1 |
_aStan, Mircea R. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _940260 |
|
710 | 2 |
_aSpringerLink (Online service) _940261 |
|
773 | 0 | _tSpringer Nature eBook | |
776 | 0 | 8 |
_iPrinted edition: _z9783030200503 |
776 | 0 | 8 |
_iPrinted edition: _z9783030200527 |
776 | 0 | 8 |
_iPrinted edition: _z9783030200534 |
856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-030-20051-0 |
912 | _aZDB-2-ENG | ||
912 | _aZDB-2-SXE | ||
942 | _cEBK | ||
999 |
_c76715 _d76715 |