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001 978-981-15-7090-2
003 DE-He213
005 20220801215614.0
007 cr nn 008mamaa
008 201123s2021 si | s |||| 0|eng d
020 _a9789811570902
_9978-981-15-7090-2
024 7 _a10.1007/978-981-15-7090-2
_2doi
050 4 _aTK7867-7867.5
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
245 1 0 _a3D Microelectronic Packaging
_h[electronic resource] :
_bFrom Architectures to Applications /
_cedited by Yan Li, Deepak Goyal.
250 _a2nd ed. 2021.
264 1 _aSingapore :
_bSpringer Nature Singapore :
_bImprint: Springer,
_c2021.
300 _aXVII, 622 p. 299 illus., 205 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringer Series in Advanced Microelectronics,
_x2197-6643 ;
_v64
505 0 _a1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging.
520 _aThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. .
650 0 _aElectronic circuits.
_919581
650 0 _aElectronics.
_93425
650 0 _aOptical materials.
_97729
650 0 _aMicrotechnology.
_928219
650 0 _aMicroelectromechanical systems.
_96063
650 0 _aMetals.
_911824
650 1 4 _aElectronic Circuits and Systems.
_945372
650 2 4 _aElectronics and Microelectronics, Instrumentation.
_932249
650 2 4 _aOptical Materials.
_97729
650 2 4 _aMicrosystems and MEMS.
_945373
650 2 4 _aMetals and Alloys.
_931871
700 1 _aLi, Yan.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_945374
700 1 _aGoyal, Deepak.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_945375
710 2 _aSpringerLink (Online service)
_945376
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9789811570896
776 0 8 _iPrinted edition:
_z9789811570919
776 0 8 _iPrinted edition:
_z9789811570926
830 0 _aSpringer Series in Advanced Microelectronics,
_x2197-6643 ;
_v64
_945377
856 4 0 _uhttps://doi.org/10.1007/978-981-15-7090-2
912 _aZDB-2-ENG
912 _aZDB-2-SXE
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