| 000 | 03959nam a22006255i 4500 | ||
|---|---|---|---|
| 001 | 978-3-319-77872-3 | ||
| 003 | DE-He213 | ||
| 005 | 20220801220554.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 180427s2018 sz | s |||| 0|eng d | ||
| 020 |
_a9783319778723 _9978-3-319-77872-3 |
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| 024 | 7 |
_a10.1007/978-3-319-77872-3 _2doi |
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| 050 | 4 | _aTS1-2301 | |
| 072 | 7 |
_aTGP _2bicssc |
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| 072 | 7 |
_aTEC020000 _2bisacsh |
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| 072 | 7 |
_aTGP _2thema |
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| 082 | 0 | 4 |
_a670 _223 |
| 100 | 1 |
_aSeok, Seonho. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _951080 |
|
| 245 | 1 | 0 |
_aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering _h[electronic resource] : _bWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / _cby Seonho Seok. |
| 250 | _a1st ed. 2018. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2018. |
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| 300 |
_aVIII, 115 p. 106 illus. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 490 | 1 |
_aSpringer Series in Advanced Manufacturing, _x2196-1735 |
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| 505 | 0 | _aOverview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. . | |
| 520 | _aThis book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. | ||
| 650 | 0 |
_aManufactures. _931642 |
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| 650 | 0 |
_aNanotechnology. _94707 |
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| 650 | 0 |
_aMicrotechnology. _928219 |
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| 650 | 0 |
_aMicroelectromechanical systems. _96063 |
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| 650 | 0 |
_aMaterials—Analysis. _951081 |
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| 650 | 0 |
_aCoatings. _96797 |
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| 650 | 0 |
_aTribology. _94149 |
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| 650 | 1 | 4 |
_aMachines, Tools, Processes. _931645 |
| 650 | 2 | 4 |
_aNanotechnology. _94707 |
| 650 | 2 | 4 |
_aMicrosystems and MEMS. _951082 |
| 650 | 2 | 4 |
_aCharacterization and Analytical Technique. _951083 |
| 650 | 2 | 4 |
_aCoatings. _96797 |
| 650 | 2 | 4 |
_aTribology. _94149 |
| 710 | 2 |
_aSpringerLink (Online service) _951084 |
|
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319778716 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319778730 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783030085612 |
| 830 | 0 |
_aSpringer Series in Advanced Manufacturing, _x2196-1735 _951085 |
|
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-77872-3 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c78706 _d78706 |
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