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001 978-3-319-20481-9
003 DE-He213
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007 cr nn 008mamaa
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020 _a9783319204819
_9978-3-319-20481-9
024 7 _a10.1007/978-3-319-20481-9
_2doi
050 4 _aTK7867-7867.5
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
245 1 0 _a3D Stacked Chips
_h[electronic resource] :
_bFrom Emerging Processes to Heterogeneous Systems /
_cedited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis.
250 _a1st ed. 2016.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2016.
300 _aXXIII, 339 p. 238 illus., 157 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aIntroduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
520 _aThis book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; •Includes discussion of 3D integration of high-density power sources and novel NVM.
650 0 _aElectronic circuits.
_919581
650 0 _aMicroprocessors.
_953086
650 0 _aComputer architecture.
_93513
650 1 4 _aElectronic Circuits and Systems.
_953087
650 2 4 _aProcessor Architectures.
_953088
700 1 _aElfadel, Ibrahim (Abe) M.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_953089
700 1 _aFettweis, Gerhard.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_953090
710 2 _aSpringerLink (Online service)
_953091
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783319204802
776 0 8 _iPrinted edition:
_z9783319204826
776 0 8 _iPrinted edition:
_z9783319793054
856 4 0 _uhttps://doi.org/10.1007/978-3-319-20481-9
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cEBK
999 _c79082
_d79082