| 000 | 03235nam a22004935i 4500 | ||
|---|---|---|---|
| 001 | 978-3-319-47597-4 | ||
| 003 | DE-He213 | ||
| 005 | 20220801221440.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 170430s2017 sz | s |||| 0|eng d | ||
| 020 |
_a9783319475974 _9978-3-319-47597-4 |
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| 024 | 7 |
_a10.1007/978-3-319-47597-4 _2doi |
|
| 050 | 4 | _aTK7867-7867.5 | |
| 072 | 7 |
_aTJFC _2bicssc |
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_aTEC008010 _2bisacsh |
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| 072 | 7 |
_aTJFC _2thema |
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| 082 | 0 | 4 |
_a621.3815 _223 |
| 100 | 1 |
_aJ.M. Veendrick, Harry. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _956084 |
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| 245 | 1 | 0 |
_aNanometer CMOS ICs _h[electronic resource] : _bFrom Basics to ASICs / _cby Harry J.M. Veendrick. |
| 250 | _a2nd ed. 2017. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2017. |
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| 300 |
_aXXXVII, 611 p. 445 illus., 271 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aBasic Principles -- Geometrical-, Physical- and Field-Scaling Impact on MOS Transistor Behavior -- Manufacture of MOS Devices -- CMOS Circuits -- Special Circuits, Devices and Technologies -- Memories -- Very Large Scale Integration (VLSI) and ASICs -- Low Power, a Hot Topic in IC Design -- Robustness of Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug and Failure Analysis -- Effects of Scaling on MOS IC Design and Consequences for the Roadmap. | |
| 520 | _aThis textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software. | ||
| 650 | 0 |
_aElectronic circuits. _919581 |
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| 650 | 0 |
_aElectronics. _93425 |
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| 650 | 1 | 4 |
_aElectronic Circuits and Systems. _956085 |
| 650 | 2 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 710 | 2 |
_aSpringerLink (Online service) _956086 |
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| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319475950 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319475967 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319837772 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-47597-4 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c79682 _d79682 |
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