000 03294nam a22005415i 4500
001 978-3-319-50824-5
003 DE-He213
005 20220801222259.0
007 cr nn 008mamaa
008 170222s2017 sz | s |||| 0|eng d
020 _a9783319508245
_9978-3-319-50824-5
024 7 _a10.1007/978-3-319-50824-5
_2doi
050 4 _aTK7867-7867.5
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
245 1 0 _aOutlook and Challenges of Nano Devices, Sensors, and MEMS
_h[electronic resource] /
_cedited by Ting Li, Ziv Liu.
250 _a1st ed. 2017.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2017.
300 _aXVI, 521 p. 367 illus., 272 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aIntroduction -- High-k dielectric for nanoscale MOS devices -- Performance, optimization, and reliability of FinFET devices -- Performance, optimization, and challenges of emerging nanowire field-effect transistors -- Graphene technology for future MEMS and sensor applications -- Nanoscale sensors for next-generation optical transceiver applications -- Nanoscale MEMS for future optical communication applications -- Nanoscale devices for biomedical applications -- Effect of nanoscale structure on reliability of nano devices and sensors -- Compact modeling of nano devices and sensors -- Three-dimensional TCAD simulation of nano semiconductor devices -- Fabrication of nano devices based on novel material -- Novel processing technology for fabricating nano devices and sensors -- Conclusions.
520 _aThis book provides readers with an overview of the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. The authors focus on how the nanoscale structures interact with the electrical and/or optical performance, how to find optimal solutions to achieve the best outcome, how these apparatus can be designed via models and simulations, how to improve reliability, and what are the possible challenges and roadblocks moving forward.
650 0 _aElectronic circuits.
_919581
650 0 _aMicrotechnology.
_928219
650 0 _aMicroelectromechanical systems.
_96063
650 0 _aNanotechnology.
_94707
650 1 4 _aElectronic Circuits and Systems.
_960654
650 2 4 _aMicrosystems and MEMS.
_960655
650 2 4 _aNanotechnology.
_94707
700 1 _aLi, Ting.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_960656
700 1 _aLiu, Ziv.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_960657
710 2 _aSpringerLink (Online service)
_960658
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783319508221
776 0 8 _iPrinted edition:
_z9783319508238
776 0 8 _iPrinted edition:
_z9783319845005
856 4 0 _uhttps://doi.org/10.1007/978-3-319-50824-5
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cEBK
999 _c80594
_d80594