| 000 | 03227nam a22005895i 4500 | ||
|---|---|---|---|
| 001 | 978-3-662-48823-2 | ||
| 003 | DE-He213 | ||
| 005 | 20220801222310.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 151031s2016 gw | s |||| 0|eng d | ||
| 020 |
_a9783662488232 _9978-3-662-48823-2 |
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| 024 | 7 |
_a10.1007/978-3-662-48823-2 _2doi |
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| 050 | 4 | _aTA349-359 | |
| 072 | 7 |
_aTGMD _2bicssc |
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| 072 | 7 |
_aSCI096000 _2bisacsh |
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| 072 | 7 |
_aTGMD _2thema |
|
| 082 | 0 | 4 |
_a620.105 _223 |
| 100 | 1 |
_aZhang, Qingke. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _960751 |
|
| 245 | 1 | 0 |
_aInvestigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces _h[electronic resource] / _cby Qingke Zhang. |
| 250 | _a1st ed. 2016. | ||
| 264 | 1 |
_aBerlin, Heidelberg : _bSpringer Berlin Heidelberg : _bImprint: Springer, _c2016. |
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| 300 |
_aXV, 143 p. 115 illus., 81 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 490 | 1 |
_aSpringer Theses, Recognizing Outstanding Ph.D. Research, _x2190-5061 |
|
| 505 | 0 | _aResearch Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions. | |
| 520 | _aThis thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. | ||
| 650 | 0 |
_aMechanics, Applied. _93253 |
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| 650 | 0 |
_aSolids. _93750 |
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| 650 | 0 |
_aSurfaces (Technology). _910743 |
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| 650 | 0 |
_aThin films. _97674 |
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| 650 | 0 |
_aMechanics. _98758 |
|
| 650 | 0 |
_aMaterials—Analysis. _960752 |
|
| 650 | 1 | 4 |
_aSolid Mechanics. _931612 |
| 650 | 2 | 4 |
_aSurfaces, Interfaces and Thin Film. _931793 |
| 650 | 2 | 4 |
_aClassical Mechanics. _931661 |
| 650 | 2 | 4 |
_aCharacterization and Analytical Technique. _960753 |
| 710 | 2 |
_aSpringerLink (Online service) _960754 |
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| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783662488218 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783662488225 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783662517253 |
| 830 | 0 |
_aSpringer Theses, Recognizing Outstanding Ph.D. Research, _x2190-5061 _960755 |
|
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-662-48823-2 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c80617 _d80617 |
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