000 02218nam a2200337 i 4500
001 CR9780511777691
003 UkCbUP
005 20230516164927.0
006 m|||||o||d||||||||
007 cr||||||||||||
008 141103s2011||||enk o ||1 0|eng|d
020 _a9780511777691 (ebook)
020 _z9780521516136 (hardback)
040 _aUkCbUP
_beng
_erda
_cUkCbUP
050 0 0 _aTA418.9.T45
_bT82 2011
082 0 0 _a621.3815/2
_222
100 1 _aTu, K. N.
_q(King-ning),
_d1937-
_eauthor.
_968255
245 1 0 _aElectronic thin film reliability /
_cKing-Ning Tu.
264 1 _aCambridge :
_bCambridge University Press,
_c2011.
300 _a1 online resource (xvi, 396 pages) :
_bdigital, PDF file(s).
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
500 _aTitle from publisher's bibliographic system (viewed on 05 Oct 2015).
520 _aThin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
650 0 _aThin films
_vTextbooks.
_968256
650 0 _aReliability (Engineering)
_vTextbooks.
_968257
776 0 8 _iPrint version:
_z9780521516136
856 4 0 _uhttps://doi.org/10.1017/CBO9780511777691
942 _cEBK
999 _c82309
_d82309