| 000 | 03284nam a22005175i 4500 | ||
|---|---|---|---|
| 001 | 978-3-031-01703-2 | ||
| 003 | DE-He213 | ||
| 005 | 20240730164613.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 220601s2008 sz | s |||| 0|eng d | ||
| 020 |
_a9783031017032 _9978-3-031-01703-2 |
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| 024 | 7 |
_a10.1007/978-3-031-01703-2 _2doi |
|
| 050 | 4 | _aT1-995 | |
| 072 | 7 |
_aTBC _2bicssc |
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| 072 | 7 |
_aTEC000000 _2bisacsh |
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| 072 | 7 |
_aTBC _2thema |
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| 082 | 0 | 4 |
_a620 _223 |
| 100 | 1 |
_aLee, Jong-Hoon. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _985322 |
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| 245 | 1 | 0 |
_aThree-Dimensional Integration and Modeling _h[electronic resource] : _bA Revolution in RF and Wireless Packaging / _cby Jong-Hoon Lee, Manos M. Tentzeris. |
| 250 | _a1st ed. 2008. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2008. |
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| 300 |
_aX, 108 p. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
||
| 490 | 1 |
_aSynthesis Lectures on Computational Electromagnetics, _x1932-1716 |
|
| 505 | 0 | _aIntroduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References. | |
| 520 | _aThis book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References. | ||
| 650 | 0 |
_aEngineering. _99405 |
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| 650 | 0 |
_aElectrical engineering. _985324 |
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| 650 | 0 |
_aTelecommunication. _910437 |
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| 650 | 1 | 4 |
_aTechnology and Engineering. _985326 |
| 650 | 2 | 4 |
_aElectrical and Electronic Engineering. _985328 |
| 650 | 2 | 4 |
_aMicrowaves, RF Engineering and Optical Communications. _931630 |
| 700 | 1 |
_aTentzeris, Manos M. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _985330 |
|
| 710 | 2 |
_aSpringerLink (Online service) _985331 |
|
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783031005756 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783031028311 |
| 830 | 0 |
_aSynthesis Lectures on Computational Electromagnetics, _x1932-1716 _985332 |
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| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-031-01703-2 |
| 912 | _aZDB-2-SXSC | ||
| 942 | _cEBK | ||
| 999 |
_c85796 _d85796 |
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