000 03796nam a22005895i 4500
001 978-3-031-02031-5
003 DE-He213
005 20240730164633.0
007 cr nn 008mamaa
008 220601s2016 sz | s |||| 0|eng d
020 _a9783031020315
_9978-3-031-02031-5
024 7 _a10.1007/978-3-031-02031-5
_2doi
050 4 _aT1-995
072 7 _aTBC
_2bicssc
072 7 _aTEC000000
_2bisacsh
072 7 _aTBC
_2thema
082 0 4 _a620
_223
100 1 _aGimenez, Salvador Pinillos.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985461
245 1 0 _aLayout Techniques in MOSFETs
_h[electronic resource] /
_cby Salvador Pinillos Gimenez.
250 _a1st ed. 2016.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2016.
300 _aXI, 69 p.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSynthesis Lectures on Emerging Engineering Technologies,
_x2381-1439
505 0 _aDedication -- Acknowledgments -- Introduction -- The Origin of the Innovative Layout Techniques for MOSFETS -- Diamond MOSFET (Hexagonal Gate Geometry) -- Octo Layout Style (Octagonal Gate Shape) for MOSFET -- Ellipsoidal Layout Style for MOSFET -- Fish Layout Style (".
520 _aThis book aims at describing in detail the different layout techniques for remarkably boosting the electrical performance and the ionizing radiation tolerance of planar Metal-Oxide-Semiconductor (MOS) Field Effect Transistors (MOSFETs) without adding any costs to the current planar Complementary MOS (CMOS) integrated circuits (ICs) manufacturing processes. These innovative layout styles are based on pn junctions engineering between the drain/source and channel regions or simply MOSFET gate layout change. These interesting layout structures are capable of incorporating new effects in the MOSFET structures, such as the Longitudinal Corner Effect (LCE), the Parallel connection of MOSFETs with Different Channel Lengths Effect (PAMDLE), the Deactivation of the Parallel MOSFETs in the Bird's Beak Regions (DEPAMBBRE), and the Drain Leakage Current Reduction Effect (DLECRE), which are still seldom explored by the semiconductor and CMOS ICs industries. Several three-dimensional (3D) numerical simulations and experimental works are referenced in this book to show how these layout techniques can help the designers to reach the analog and digital CMOS ICs specifications with no additional cost. Furthermore, the electrical performance and ionizing radiation robustness of the analog and digital CMOS ICs can significantly be increased by using this gate layout approach.
650 0 _aEngineering.
_99405
650 0 _aElectrical engineering.
_985463
650 0 _aElectronic circuits.
_919581
650 0 _aComputers.
_98172
650 0 _aMaterials science.
_95803
650 0 _aSurfaces (Technology).
_910743
650 0 _aThin films.
_97674
650 1 4 _aTechnology and Engineering.
_985466
650 2 4 _aElectrical and Electronic Engineering.
_985468
650 2 4 _aElectronic Circuits and Systems.
_985470
650 2 4 _aComputer Hardware.
_933420
650 2 4 _aMaterials Science.
_95803
650 2 4 _aSurfaces, Interfaces and Thin Film.
_931793
710 2 _aSpringerLink (Online service)
_985474
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783031009037
776 0 8 _iPrinted edition:
_z9783031031595
830 0 _aSynthesis Lectures on Emerging Engineering Technologies,
_x2381-1439
_985476
856 4 0 _uhttps://doi.org/10.1007/978-3-031-02031-5
912 _aZDB-2-SXSC
942 _cEBK
999 _c85812
_d85812