000 03750nam a22006375i 4500
001 978-3-031-02035-3
003 DE-He213
005 20240730164641.0
007 cr nn 008mamaa
008 220601s2020 sz | s |||| 0|eng d
020 _a9783031020353
_9978-3-031-02035-3
024 7 _a10.1007/978-3-031-02035-3
_2doi
050 4 _aT1-995
072 7 _aTBC
_2bicssc
072 7 _aTEC000000
_2bisacsh
072 7 _aTBC
_2thema
082 0 4 _a620
_223
100 1 _aBaranov, Oleg O.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985510
245 1 0 _aAdvanced Concepts and Architectures for Plasma-Enabled Material Processing
_h[electronic resource] /
_cby Oleg O. Baranov, Igor Levchenko, Shuyan Xu, Kateryna Bazaka.
250 _a1st ed. 2020.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2020.
300 _aVIII, 82 p.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSynthesis Lectures on Emerging Engineering Technologies,
_x2381-1439
505 0 _aIntroduction -- Technological Plasmas and Typical Schematics -- Plasma Parameters with Respect to Material Processing -- How to Control Plasma Parameters -- Material Processing -- Perspectives and Trends -- Conclusion -- Authors' Biographies.
520 _aPlasma-based techniques are widely and successfully used across the field of materials processing, advanced nanosynthesis, and nanofabrication. The diversity of currently available processing architectures based on or enhanced by the use of plasmas is vast, and one can easily get lost in the opportunities presented by each of these configurations. This mini-book provides a concise outline of the most important concepts and architectures in plasma-assisted processing of materials, helping the reader navigate through the fundamentals of plasma system selection and optimization. Architectures discussed in this book range from the relatively simple, user-friendly types of plasmas produced using direct current, radio-frequency, microwave, and arc systems, to more sophisticated advanced systems based on incorporating and external substrate architectures, and complex control mechanisms of configured magnetic fields and distributed plasma sources.
650 0 _aEngineering.
_99405
650 0 _aElectrical engineering.
_985511
650 0 _aElectronic circuits.
_919581
650 0 _aComputers.
_98172
650 0 _aMaterials science.
_95803
650 0 _aSurfaces (Technology).
_910743
650 0 _aThin films.
_97674
650 1 4 _aTechnology and Engineering.
_985515
650 2 4 _aElectrical and Electronic Engineering.
_985518
650 2 4 _aElectronic Circuits and Systems.
_985519
650 2 4 _aComputer Hardware.
_933420
650 2 4 _aMaterials Science.
_95803
650 2 4 _aSurfaces, Interfaces and Thin Film.
_931793
700 1 _aLevchenko, Igor.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985521
700 1 _aXu, Shuyan.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985522
700 1 _aBazaka, Kateryna.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985523
710 2 _aSpringerLink (Online service)
_985525
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783031001413
776 0 8 _iPrinted edition:
_z9783031009075
776 0 8 _iPrinted edition:
_z9783031031632
830 0 _aSynthesis Lectures on Emerging Engineering Technologies,
_x2381-1439
_985526
856 4 0 _uhttps://doi.org/10.1007/978-3-031-02035-3
912 _aZDB-2-SXSC
942 _cEBK
999 _c85819
_d85819