000 03196nam a22004935i 4500
001 978-3-031-02553-2
003 DE-He213
005 20240730164730.0
007 cr nn 008mamaa
008 220601s2008 sz | s |||| 0|eng d
020 _a9783031025532
_9978-3-031-02553-2
024 7 _a10.1007/978-3-031-02553-2
_2doi
050 4 _aTK1-9971
072 7 _aTHR
_2bicssc
072 7 _aTEC007000
_2bisacsh
072 7 _aTHR
_2thema
082 0 4 _a621.3
_223
100 1 _aChen, Ray T.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985842
245 1 0 _aOptical Interconnects
_h[electronic resource] /
_cby Ray T. Chen, Chulchae Choi.
250 _a1st ed. 2008.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2008.
300 _aXI, 91 p.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSynthesis Lectures on Solid State Materials and Devices,
_x1932-1724
505 0 _aIntroduction -- Thinned Vertical Cavity Surface Emitting Laser Fabrication -- VCSEL Characterization -- Thermal Management of Embedded VCSEL -- Optical Interconnection Layer -- System Integration -- Summary -- Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System.
520 _aThis book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
650 0 _aElectrical engineering.
_985843
650 0 _aMaterials science.
_95803
650 1 4 _aElectrical and Electronic Engineering.
_985846
650 2 4 _aMaterials Science.
_95803
700 1 _aChoi, Chulchae.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_985847
710 2 _aSpringerLink (Online service)
_985848
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783031014253
776 0 8 _iPrinted edition:
_z9783031036811
830 0 _aSynthesis Lectures on Solid State Materials and Devices,
_x1932-1724
_985849
856 4 0 _uhttps://doi.org/10.1007/978-3-031-02553-2
912 _aZDB-2-SXSC
942 _cEBK
999 _c85866
_d85866