Kaushik, Brajesh Kumar,
Through silicon vias : materials, models, design, and performance / Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam. - 1 online resource
1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
9781315368825 9781315332758
10.1201/9781315368825 doi
Three-dimensional integrated circuits.
Interconnects (Integrated circuit technology)
TK7874.53 / .K38 2017
621.395 / K217
Through silicon vias : materials, models, design, and performance / Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam. - 1 online resource
1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
9781315368825 9781315332758
10.1201/9781315368825 doi
Three-dimensional integrated circuits.
Interconnects (Integrated circuit technology)
TK7874.53 / .K38 2017
621.395 / K217