Through silicon vias : (Record no. 70657)

000 -LEADER
fixed length control field 01835cam a2200361Ii 4500
001 - CONTROL NUMBER
control field 9781315368825
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 180706t20172017flua ob 001 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9781315368825
-- (e-book : PDF)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9781315332758
-- (e-book: Mobi)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- (hardback)
082 04 - CLASSIFICATION NUMBER
Call Number 621.395
-- K217
100 1# - AUTHOR NAME
Author Kaushik, Brajesh Kumar,
245 10 - TITLE STATEMENT
Title Through silicon vias :
Sub Title materials, models, design, and performance /
300 ## - PHYSICAL DESCRIPTION
Number of Pages 1 online resource
505 0# - FORMATTED CONTENTS NOTE
Remark 2 1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
700 1# - AUTHOR 2
Author 2 Alam, Arsalan,
700 1# - AUTHOR 2
Author 2 Kumar, Vobulapuram Ramesh,
700 1# - AUTHOR 2
Author 2 Majumder, Manoj Kumar,
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://www.taylorfrancis.com/books/9781315368825
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Boca Raton :
-- CRC Press,
-- [2017]
264 #4 -
-- ©2017
336 ## -
-- text
-- rdacontent
337 ## -
-- computer
-- rdamedia
338 ## -
-- online resource
-- rdacarrier
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Three-dimensional integrated circuits.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Interconnects (Integrated circuit technology)

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