Lee, Jong-Hoon.
Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging / [electronic resource] : by Jong-Hoon Lee, Manos M. Tentzeris. - 1st ed. 2008. - X, 108 p. online resource. - Synthesis Lectures on Computational Electromagnetics, 1932-1716 . - Synthesis Lectures on Computational Electromagnetics, .
Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
9783031017032
10.1007/978-3-031-01703-2 doi
Engineering.
Electrical engineering.
Telecommunication.
Technology and Engineering.
Electrical and Electronic Engineering.
Microwaves, RF Engineering and Optical Communications.
T1-995
620
Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging / [electronic resource] : by Jong-Hoon Lee, Manos M. Tentzeris. - 1st ed. 2008. - X, 108 p. online resource. - Synthesis Lectures on Computational Electromagnetics, 1932-1716 . - Synthesis Lectures on Computational Electromagnetics, .
Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
9783031017032
10.1007/978-3-031-01703-2 doi
Engineering.
Electrical engineering.
Telecommunication.
Technology and Engineering.
Electrical and Electronic Engineering.
Microwaves, RF Engineering and Optical Communications.
T1-995
620