Three-Dimensional Integration and Modeling (Record no. 85796)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03284nam a22005175i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-031-01703-2 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20240730164613.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 220601s2008 sz | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783031017032 |
| -- | 978-3-031-01703-2 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 620 |
| 100 1# - AUTHOR NAME | |
| Author | Lee, Jong-Hoon. |
| 245 10 - TITLE STATEMENT | |
| Title | Three-Dimensional Integration and Modeling |
| Sub Title | A Revolution in RF and Wireless Packaging / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2008. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | X, 108 p. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Synthesis Lectures on Computational Electromagnetics, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Tentzeris, Manos M. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-3-031-01703-2 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2008. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electrical engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Telecommunication. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Technology and Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electrical and Electronic Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microwaves, RF Engineering and Optical Communications. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 1932-1716 |
| 912 ## - | |
| -- | ZDB-2-SXSC |
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