Designing TSVs for 3D Integrated Circuits (Record no. 57031)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 03149nam a22005175i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4614-5508-0 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421112048.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 120922s2013 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781461455080 |
| -- | 978-1-4614-5508-0 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3815 |
| 100 1# - AUTHOR NAME | |
| Author | Khan, Nauman. |
| 245 10 - TITLE STATEMENT | |
| Title | Designing TSVs for 3D Integrated Circuits |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | X, 76 p. 34 illus., 29 illus. in color. |
| 490 1# - SERIES STATEMENT | |
| Series statement | SpringerBriefs in Electrical and Computer Engineering, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Hassoun, Soha. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4614-5508-0 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | New York, NY : |
| -- | Springer New York : |
| -- | Imprint: Springer, |
| -- | 2013. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microprocessors. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Processor Architectures. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 2191-8112 |
| 912 ## - | |
| -- | ZDB-2-ENG |
No items available.