Energy-Efficient Computing and Data Centers (Record no. 69123)

000 -LEADER
fixed length control field 04739cam a2200553Ia 4500
001 - CONTROL NUMBER
control field on1111945114
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220711203529.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 190824s2019 enk o 000 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9781119422037
-- (electronic bk. : oBook)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 1119422035
-- (electronic bk. : oBook)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9781119648802
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 1119648807
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9781119648796
-- (ePub ebook)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 1119648793
029 1# - (OCLC)
OCLC library identifier AU@
System control number 000066005320
029 1# - (OCLC)
OCLC library identifier UKMGB
System control number 019504794
037 ## -
-- 9781119648796
-- Wiley
082 04 - CLASSIFICATION NUMBER
Call Number 004.068
245 00 - TITLE STATEMENT
Title Energy-Efficient Computing and Data Centers
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication London :
Publisher ISTE, Ltd. ;
Place of publication Hoboken :
Publisher John Wiley & Sons, Incorporated,
Year of publication 2019.
300 ## - PHYSICAL DESCRIPTION
Number of Pages 1 online resource (238 p.)
500 ## - GENERAL NOTE
Remark 1 Description based upon print version of record.
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Cover; Half-Title Page; Title Page; Copyright Page; Contents; Introduction; Acknowledgments; 1. Systems in Data Centers; 1.1. Servers; 1.2. Storage arrays; 1.3. Data center networking; 1.4. Components; 1.4.1. Central processing unit; 1.4.2. Graphics processing unit; 1.4.3. Volatile memory; 1.4.4. Non-volatile memory; 1.4.5. Non-volatile storage; 1.4.6. Spinning disks and tape storage; 1.4.7. Motherboard; 1.4.8. PCIe I/O cards; 1.4.9. Power supplies; 1.4.10. Fans; 2. Cooling Servers; 2.1. Evolution of cooling for mainframe, midrange and distributed computers from the 1960s to 1990s
505 8# - FORMATTED CONTENTS NOTE
Remark 2 2.2. Emergence of cooling for scale out computers from 1990s to 2010s2.3. Chassis and rack cooling methods; 2.4. Metrics considered for cooling; 2.4.1. Efficiency; 2.4.2. Reliability cost; 2.4.3. Thermal performance; 2.5. Material used for cooling; 2.6. System layout and cooling air flow optimization; 3. Cooling the Data Center; 3.1. System cooling technologies used; 3.2. Air-cooled data center; 3.2.1. Conventional air-cooled data center; 3.3. ASHRAE data center cooling standards; 3.3.1. Operation and temperature classes; 3.3.2. Liquid cooling classes; 3.3.3. Server and rack power trend
505 8# - FORMATTED CONTENTS NOTE
Remark 2 3.4. Liquid-cooled racks3.5. Liquid-cooled servers; 3.5.1. Water heat capacity; 3.5.2. Thermal conduction module; 3.5.3. Full node heat removal with cold plates; 3.5.4. Modular heat removal with cold plates; 3.5.5. Immersion cooling; 3.5.6. Recent DWC servers; 3.6. Free cooling; 3.7. Waste heat reuse; 3.7.1. Reusing heat as heat; 3.7.2. Transforming heat with adsorption chillers; 4. Power Consumption of Servers and Workloads; 4.1. Trends in power consumption for processors; 4.1.1. Moore's and Dennard's laws; 4.1.2. Floating point instructions on Xeon processors
505 8# - FORMATTED CONTENTS NOTE
Remark 2 4.1.3. CPU frequency of instructions on Intel Xeon processors4.2. Trends in power consumption for GPUs; 4.2.1. Moore's and Dennard's laws; 4.3. ACPI states; 4.4. The power equation; 5. Power and Performance of Workloads; 5.1. Power and performance of workloads; 5.1.1. SKU power and performance variations; 5.1.2. System parameters; 5.1.3. Workloads used; 5.1.4. CPU-bound and memory-bound workloads; 5.1.5. DC node power versus components power; 5.2. Power, thermal and performance on air-cooled servers with Intel Xeon; 5.2.1. Frequency, power and performance of simple SIMD instructions
505 8# - FORMATTED CONTENTS NOTE
Remark 2 5.2.2. Power, thermal and performance behavior of HPL5.2.3. Power, thermal and performance behavior of STREAM; 5.2.4. Power, thermal and performance behavior of real workloads; 5.2.5. Power, thermal and frequency differences between CPUs; 5.3. Power, thermal and performance on water-cooled servers with Intel Xeon; 5.3.1. Impact on CPU temperature; 5.3.2. Impact on voltage and frequency; 5.3.3. Impact on power consumption and performance; 5.4. Conclusions on the impact of cooling on power and performance; 6. Monitoring and Controlling Power and Performance of Servers and Data Centers
500 ## - GENERAL NOTE
Remark 1 6.1. Monitoring power and performance of servers
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
General subdivision Energy consumption.
700 1# - AUTHOR 2
Author 2 Brochard, Luigi.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1002/9781119422037
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
336 ## -
-- text
-- rdacontent
337 ## -
-- computer
-- rdamedia
338 ## -
-- online resource
-- rdacarrier
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Data centers
994 ## -
-- 92
-- DG1

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