Central Library

Normal view MARC view ISBD view

Energy-Efficient Computing and Data Centers [electronic resource] / Luigi Brochard... [et al.].

Contributor(s): Brochard, Luigi.
Material type: materialTypeLabelBookPublisher: London : Hoboken : ISTE, Ltd. ; John Wiley & Sons, Incorporated, 2019Description: 1 online resource (238 p.).Content type: text Media type: computer Carrier type: online resourceISBN: 9781119422037; 1119422035; 9781119648802; 1119648807; 9781119648796; 1119648793.Subject(s): Data centers -- Energy consumptionGenre/Form: Electronic books.Additional physical formats: Print version:: Energy-Efficient Computing and Data CentersDDC classification: 004.068 Online resources: Wiley Online Library
Contents:
Cover; Half-Title Page; Title Page; Copyright Page; Contents; Introduction; Acknowledgments; 1. Systems in Data Centers; 1.1. Servers; 1.2. Storage arrays; 1.3. Data center networking; 1.4. Components; 1.4.1. Central processing unit; 1.4.2. Graphics processing unit; 1.4.3. Volatile memory; 1.4.4. Non-volatile memory; 1.4.5. Non-volatile storage; 1.4.6. Spinning disks and tape storage; 1.4.7. Motherboard; 1.4.8. PCIe I/O cards; 1.4.9. Power supplies; 1.4.10. Fans; 2. Cooling Servers; 2.1. Evolution of cooling for mainframe, midrange and distributed computers from the 1960s to 1990s
2.2. Emergence of cooling for scale out computers from 1990s to 2010s2.3. Chassis and rack cooling methods; 2.4. Metrics considered for cooling; 2.4.1. Efficiency; 2.4.2. Reliability cost; 2.4.3. Thermal performance; 2.5. Material used for cooling; 2.6. System layout and cooling air flow optimization; 3. Cooling the Data Center; 3.1. System cooling technologies used; 3.2. Air-cooled data center; 3.2.1. Conventional air-cooled data center; 3.3. ASHRAE data center cooling standards; 3.3.1. Operation and temperature classes; 3.3.2. Liquid cooling classes; 3.3.3. Server and rack power trend
3.4. Liquid-cooled racks3.5. Liquid-cooled servers; 3.5.1. Water heat capacity; 3.5.2. Thermal conduction module; 3.5.3. Full node heat removal with cold plates; 3.5.4. Modular heat removal with cold plates; 3.5.5. Immersion cooling; 3.5.6. Recent DWC servers; 3.6. Free cooling; 3.7. Waste heat reuse; 3.7.1. Reusing heat as heat; 3.7.2. Transforming heat with adsorption chillers; 4. Power Consumption of Servers and Workloads; 4.1. Trends in power consumption for processors; 4.1.1. Moore's and Dennard's laws; 4.1.2. Floating point instructions on Xeon processors
4.1.3. CPU frequency of instructions on Intel Xeon processors4.2. Trends in power consumption for GPUs; 4.2.1. Moore's and Dennard's laws; 4.3. ACPI states; 4.4. The power equation; 5. Power and Performance of Workloads; 5.1. Power and performance of workloads; 5.1.1. SKU power and performance variations; 5.1.2. System parameters; 5.1.3. Workloads used; 5.1.4. CPU-bound and memory-bound workloads; 5.1.5. DC node power versus components power; 5.2. Power, thermal and performance on air-cooled servers with Intel Xeon; 5.2.1. Frequency, power and performance of simple SIMD instructions
5.2.2. Power, thermal and performance behavior of HPL5.2.3. Power, thermal and performance behavior of STREAM; 5.2.4. Power, thermal and performance behavior of real workloads; 5.2.5. Power, thermal and frequency differences between CPUs; 5.3. Power, thermal and performance on water-cooled servers with Intel Xeon; 5.3.1. Impact on CPU temperature; 5.3.2. Impact on voltage and frequency; 5.3.3. Impact on power consumption and performance; 5.4. Conclusions on the impact of cooling on power and performance; 6. Monitoring and Controlling Power and Performance of Servers and Data Centers
    average rating: 0.0 (0 votes)
No physical items for this record

Description based upon print version of record.

Cover; Half-Title Page; Title Page; Copyright Page; Contents; Introduction; Acknowledgments; 1. Systems in Data Centers; 1.1. Servers; 1.2. Storage arrays; 1.3. Data center networking; 1.4. Components; 1.4.1. Central processing unit; 1.4.2. Graphics processing unit; 1.4.3. Volatile memory; 1.4.4. Non-volatile memory; 1.4.5. Non-volatile storage; 1.4.6. Spinning disks and tape storage; 1.4.7. Motherboard; 1.4.8. PCIe I/O cards; 1.4.9. Power supplies; 1.4.10. Fans; 2. Cooling Servers; 2.1. Evolution of cooling for mainframe, midrange and distributed computers from the 1960s to 1990s

2.2. Emergence of cooling for scale out computers from 1990s to 2010s2.3. Chassis and rack cooling methods; 2.4. Metrics considered for cooling; 2.4.1. Efficiency; 2.4.2. Reliability cost; 2.4.3. Thermal performance; 2.5. Material used for cooling; 2.6. System layout and cooling air flow optimization; 3. Cooling the Data Center; 3.1. System cooling technologies used; 3.2. Air-cooled data center; 3.2.1. Conventional air-cooled data center; 3.3. ASHRAE data center cooling standards; 3.3.1. Operation and temperature classes; 3.3.2. Liquid cooling classes; 3.3.3. Server and rack power trend

3.4. Liquid-cooled racks3.5. Liquid-cooled servers; 3.5.1. Water heat capacity; 3.5.2. Thermal conduction module; 3.5.3. Full node heat removal with cold plates; 3.5.4. Modular heat removal with cold plates; 3.5.5. Immersion cooling; 3.5.6. Recent DWC servers; 3.6. Free cooling; 3.7. Waste heat reuse; 3.7.1. Reusing heat as heat; 3.7.2. Transforming heat with adsorption chillers; 4. Power Consumption of Servers and Workloads; 4.1. Trends in power consumption for processors; 4.1.1. Moore's and Dennard's laws; 4.1.2. Floating point instructions on Xeon processors

4.1.3. CPU frequency of instructions on Intel Xeon processors4.2. Trends in power consumption for GPUs; 4.2.1. Moore's and Dennard's laws; 4.3. ACPI states; 4.4. The power equation; 5. Power and Performance of Workloads; 5.1. Power and performance of workloads; 5.1.1. SKU power and performance variations; 5.1.2. System parameters; 5.1.3. Workloads used; 5.1.4. CPU-bound and memory-bound workloads; 5.1.5. DC node power versus components power; 5.2. Power, thermal and performance on air-cooled servers with Intel Xeon; 5.2.1. Frequency, power and performance of simple SIMD instructions

5.2.2. Power, thermal and performance behavior of HPL5.2.3. Power, thermal and performance behavior of STREAM; 5.2.4. Power, thermal and performance behavior of real workloads; 5.2.5. Power, thermal and frequency differences between CPUs; 5.3. Power, thermal and performance on water-cooled servers with Intel Xeon; 5.3.1. Impact on CPU temperature; 5.3.2. Impact on voltage and frequency; 5.3.3. Impact on power consumption and performance; 5.4. Conclusions on the impact of cooling on power and performance; 6. Monitoring and Controlling Power and Performance of Servers and Data Centers

6.1. Monitoring power and performance of servers

There are no comments for this item.

Log in to your account to post a comment.