3D and circuit integration of MEMS (Record no. 69524)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03305cam a2200589Ii 4500 |
| 001 - CONTROL NUMBER | |
| control field | on1245419748 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220711203655.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 201211s2021 gw fo 000 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783527823239 |
| -- | (electronic bk. : oBook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 3527823239 |
| -- | (electronic bk. : oBook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783527823253 |
| -- | (e-book) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 3527823255 |
| -- | (e-book) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783527823246 |
| -- | (ePub ebook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 3527823247 |
| -- | (ePub ebook) |
| 029 1# - (OCLC) | |
| OCLC library identifier | UKMGB |
| System control number | 020043536 |
| 029 1# - (OCLC) | |
| OCLC library identifier | AU@ |
| System control number | 000068943357 |
| 037 ## - | |
| -- | 9783527823246 |
| -- | Wiley |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.38152 |
| 100 1# - AUTHOR NAME | |
| Author | Esashi, Masayoshi, |
| 245 10 - TITLE STATEMENT | |
| Title | 3D and circuit integration of MEMS |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 online resource |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Front Matter -- Overview / Masayoshi Esashi -- Bulk Micromachining / Xinxin Li, Heng Yang -- Enhanced Bulk Micromachining Based on MIS Process / Xinxin Li, Heng Yang -- Epitaxial Poly Si Surface Micromachining / Masayoshi Esashi -- Poly-SiGe Surface Micromachining / Carrie W Low, Sergio F Almeida, Emmanuel P Quvy, Roger T Howe -- Metal Surface Micromachining / Minoru Sasaki -- Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters / Enes Calayir, Srinivas Merugu, Jaewung Lee, Navab Singh, Gianluca Piazza -- MEMS Using CMOS Wafer / Weileun Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li -- Wafer Transfer / Masayoshi Esashi -- Piezoelectric MEMS / T Takeshi Kobayashi (AIST) -- Anodic Bonding / Masayoshi Esashi -- Direct Bonding / Hideki Takagi -- Metal Bonding / Joerg Froemel -- Reactive Bonding / Klaus Vogel, Silvia Braun, Christian Hofmann, Mathias Weiser, Maik Wiemer, Thomas Otto, Harald Kuhn -- Polymer Bonding / Xiaojing Wang, Frank Niklaus -- Soldering by Local Heating / Yu-Ting Cheng, Liwei Lin -- Packaging, Sealing, and Interconnection / Masayoshi Esashi -- Vacuum Packaging / Masayoshi Esashi -- Buried Channels in Monolithic Si / Kazusuke Maenaka -- Through-substrate Vias / Zhyao Wang -- Index |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1002/9783527823239 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Weinheim : |
| -- | Wiley-VCH, |
| -- | 2021. |
| 336 ## - | |
| -- | text |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | rdacarrier |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectromechanical systems. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Silicon-on-insulator technology. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Integrated circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Metal oxide semiconductors, Complementary. |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Integrated circuits. |
| -- | (OCoLC)fst00975535 |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Metal oxide semiconductors, Complementary. |
| -- | (OCoLC)fst01017635 |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectromechanical systems. |
| -- | (OCoLC)fst01019745 |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Silicon-on-insulator technology. |
| -- | (OCoLC)fst01118704 |
| 994 ## - | |
| -- | 92 |
| -- | DG1 |
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