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3D and circuit integration of MEMS Masayoshi Esashi.

By: Esashi, Masayoshi, 1949- [author.].
Material type: materialTypeLabelBookPublisher: Weinheim : Wiley-VCH, 2021Description: 1 online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783527823239; 3527823239; 9783527823253; 3527823255; 9783527823246; 3527823247.Subject(s): Microelectromechanical systems | Silicon-on-insulator technology | Integrated circuits | Metal oxide semiconductors, Complementary | Integrated circuits | Metal oxide semiconductors, Complementary | Microelectromechanical systems | Silicon-on-insulator technologyGenre/Form: Electronic books.Additional physical formats: Print version :: No titleDDC classification: 621.38152 Online resources: Wiley Online Library
Contents:
Front Matter -- Overview / Masayoshi Esashi -- Bulk Micromachining / Xinxin Li, Heng Yang -- Enhanced Bulk Micromachining Based on MIS Process / Xinxin Li, Heng Yang -- Epitaxial Poly Si Surface Micromachining / Masayoshi Esashi -- Poly-SiGe Surface Micromachining / Carrie W Low, Sergio F Almeida, Emmanuel P Quvy, Roger T Howe -- Metal Surface Micromachining / Minoru Sasaki -- Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters / Enes Calayir, Srinivas Merugu, Jaewung Lee, Navab Singh, Gianluca Piazza -- MEMS Using CMOS Wafer / Weileun Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li -- Wafer Transfer / Masayoshi Esashi -- Piezoelectric MEMS / T Takeshi Kobayashi (AIST) -- Anodic Bonding / Masayoshi Esashi -- Direct Bonding / Hideki Takagi -- Metal Bonding / Joerg Froemel -- Reactive Bonding / Klaus Vogel, Silvia Braun, Christian Hofmann, Mathias Weiser, Maik Wiemer, Thomas Otto, Harald Kuhn -- Polymer Bonding / Xiaojing Wang, Frank Niklaus -- Soldering by Local Heating / Yu-Ting Cheng, Liwei Lin -- Packaging, Sealing, and Interconnection / Masayoshi Esashi -- Vacuum Packaging / Masayoshi Esashi -- Buried Channels in Monolithic Si / Kazusuke Maenaka -- Through-substrate Vias / Zhyao Wang -- Index
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Front Matter -- Overview / Masayoshi Esashi -- Bulk Micromachining / Xinxin Li, Heng Yang -- Enhanced Bulk Micromachining Based on MIS Process / Xinxin Li, Heng Yang -- Epitaxial Poly Si Surface Micromachining / Masayoshi Esashi -- Poly-SiGe Surface Micromachining / Carrie W Low, Sergio F Almeida, Emmanuel P Quvy, Roger T Howe -- Metal Surface Micromachining / Minoru Sasaki -- Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters / Enes Calayir, Srinivas Merugu, Jaewung Lee, Navab Singh, Gianluca Piazza -- MEMS Using CMOS Wafer / Weileun Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li -- Wafer Transfer / Masayoshi Esashi -- Piezoelectric MEMS / T Takeshi Kobayashi (AIST) -- Anodic Bonding / Masayoshi Esashi -- Direct Bonding / Hideki Takagi -- Metal Bonding / Joerg Froemel -- Reactive Bonding / Klaus Vogel, Silvia Braun, Christian Hofmann, Mathias Weiser, Maik Wiemer, Thomas Otto, Harald Kuhn -- Polymer Bonding / Xiaojing Wang, Frank Niklaus -- Soldering by Local Heating / Yu-Ting Cheng, Liwei Lin -- Packaging, Sealing, and Interconnection / Masayoshi Esashi -- Vacuum Packaging / Masayoshi Esashi -- Buried Channels in Monolithic Si / Kazusuke Maenaka -- Through-substrate Vias / Zhyao Wang -- Index

Wiley Frontlist Obook All English 2021

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