Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach (Record no. 75894)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03216nam a22004935i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-319-75769-8 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220801214037.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 180312s2018 sz | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783319757698 |
| -- | 978-3-319-75769-8 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3815 |
| 100 1# - AUTHOR NAME | |
| Author | Yazdani, Farhang. |
| 245 10 - TITLE STATEMENT | |
| Title | Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2018. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | X, 177 p. 155 illus., 152 illus. in color. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-3-319-75769-8 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2018. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 912 ## - | |
| -- | ZDB-2-SXE |
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