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Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach [electronic resource] / by Farhang Yazdani.

By: Yazdani, Farhang [author.].
Contributor(s): SpringerLink (Online service).
Material type: materialTypeLabelBookPublisher: Cham : Springer International Publishing : Imprint: Springer, 2018Edition: 1st ed. 2018.Description: X, 177 p. 155 illus., 152 illus. in color. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783319757698.Subject(s): Electronic circuits | Electronics | Electronic Circuits and Systems | Electronics and Microelectronics, InstrumentationAdditional physical formats: Printed edition:: No title; Printed edition:: No title; Printed edition:: No titleDDC classification: 621.3815 Online resources: Click here to access online
Contents:
Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.
In: Springer Nature eBookSummary: This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
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Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.

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