Lead-free soldering process development and reliability / edited by Jasbir Bath, Bath Consultancy LLC.
Contributor(s): Bath, Jasbir [editor.]
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Material type: 
BookSeries: Wiley series in quality and reliability engineering: Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2020Copyright date: ©2020Description: 1 online resource (xxii, 481 pages) : illustrations.Content type: text Media type: computer Carrier type: online resourceISBN: 9781119482093; 1119482097; 1119482046; 9781119482048.Subject(s): Electronic packaging | Solder and soldering | Electronic packaging | Solder and solderingGenre/Form: Electronic books.Additional physical formats: Print version:: Lead-free soldering process development and reliabilityDDC classification: 621.381/046 Online resources: Wiley Online Library Summary: "This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"-- Provided by publisher.
Includes bibliographical references and index.
"This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"-- Provided by publisher.
Description based on online resource; title from digital title page (viewed on August 04, 2020).
John Wiley and Sons Wiley Frontlist Obook All English 2020
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