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Three-Dimensional Integration and Modeling [electronic resource] : A Revolution in RF and Wireless Packaging / by Jong-Hoon Lee, Manos M. Tentzeris.

By: Lee, Jong-Hoon [author.].
Contributor(s): Tentzeris, Manos M [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: Synthesis Lectures on Computational Electromagnetics: Publisher: Cham : Springer International Publishing : Imprint: Springer, 2008Edition: 1st ed. 2008.Description: X, 108 p. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783031017032.Subject(s): Engineering | Electrical engineering | Telecommunication | Technology and Engineering | Electrical and Electronic Engineering | Microwaves, RF Engineering and Optical CommunicationsAdditional physical formats: Printed edition:: No title; Printed edition:: No titleDDC classification: 620 Online resources: Click here to access online
Contents:
Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
In: Springer Nature eBookSummary: This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
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Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.

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