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Advanced electronic packaging.
by Brown, William D, 1943- | Ulrich, Richard K. (Richard Kevin), 1955- | John Wiley & Sons [publisher.] | IEEE Xplore (Online service) [distributor.]. Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Online access: Abstract with links to resource Availability: No items available
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Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown.
by Ulrich, Richard Kevin, 1955- | Brown, William D, 1943- | IEEE Xplore (Online Service) [distributor.] | John Wiley & Sons [publisher.]. Edition: 2nd edMaterial type: Book; Format:
available online
Publisher: Hoboken, New Jersey : $bWiley-Interscience, c2006Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2006]Online access: Abstract with links to resource Availability: No items available
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Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang.
by Liu, Duixian [editor.] | Zhang, Yueping [editor.]. Edition: First edition.Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, New Jersey : Wiley-IEEE Press, [2020]Online access: Wiley Online Library Availability: No items available
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Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kröhnert.
by Keser, Beth, 1971- [editor.] | Kroehnert, Steffen, 1970- [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019Copyright date: ©2019Online access: Wiley Online Library Availability: No items available
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Lead-free soldering process development and reliability / edited by Jasbir Bath, Bath Consultancy LLC.
by Bath, Jasbir [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2020Copyright date: ©2020Online access: Wiley Online Library Availability: No items available
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Packaging technology and engineering : pharmaceutical, medical and food applications / Dipak Kumar Sarker.
by Sarker, Dipak K [author.]. Edition: First edition.Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, NJ : Wiley, 2020Online access: Wiley Online Library Availability: No items available
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Nanotechnology-enhanced food packaging / edited by Jyotishkumar Parameswaranpillai, Radhakrishnan E.K., Aswathy Jayakumar, Sanjay Mavinkere Rangappa, Suchart Siengchin.
by Parameswaranpillai, Jyotishkumar [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Weinheim, Germany : Wiley-VCH, [2022]Online access: Wiley Online Library Availability: No items available
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Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / edited by Beth Keser, Steffen Kröhnert.
by Keser, Beth, 1971- [editor.] | Kröhnert, Steffen [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Newark : John Wiley & Sons, Incorporated, 2021Online access: Wiley Online Library Availability: No items available
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Electronic packaging science and technology / King-Ning Tu, University of California, Los Angeles, United States of America; Chih Chen, National Chiao Tung University, Hsinchu, Taiwain; Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwain.
by Tu, K. N. (King-Ning), 1937- [author.] | Chen, Chih, 1970- [author.] | Chen, Hung-Ming [author.]. Edition: 1st edition.Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, NJ : Wiley, 2022Online access: Wiley Online Library Availability: No items available
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Energy Storage Systems in Electronics / editors, Tetsuya Osaka, Madhav Datta.
by Datta, Madhav [editor.] | Osaka, Tetsuya [editor.]. Edition: First edition.Material type: Book; Literary form:
Not fiction
Publisher: Boca Raton, FL : CRC Press, 2014Online access: Click here to view. Availability: No items available
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Chitin- and Chitosan-Based Biocomposites for Food Packaging Applications [electronic resource].
by Thomas, Sabu | Jacob, Jissy | Loganathan, Sravanthi. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Milton : CRC Press LLC, 2020Online access: Taylor & Francis | OCLC metadata license agreement Availability: No items available
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Food packaging : advanced materials, technologies, and innovations / edited by Sanjay Mavinkere Rangappa, Jyotishkumar Parameswaranpillai, Senthil Muthu Kumar Thiagamani, Senthilkumar Krishnasamy, Suchart Siengchin.
by Rangappa, Sanjay Mavinkere [editor.] | Parameswaranpillai, Jyotishkumar [editor.] | Thiagamani, Senthil Muthu Kumar [editor.] | Krishnasamy, Senthilkumar [editor.] | Siengchin, Suchart [editor.]. Edition: First edition.Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Boca Raton, FL : CRC Press, 2021Copyright date: ©2021Online access: Taylor & Francis | OCLC metadata license agreement Availability: No items available
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MEMS : fundamental technology and applications / editors, Vikas Choudhary, Krzysztof Iniewski.
by Choudhary, Vikas | Iniewski, Krzysztof. Material type: Book; Literary form:
Not fiction
Publisher: Boca Raton : Taylor & Francis, 2013Online access: Click here to view. Availability: No items available
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Food packaging materials : testing & quality assurance / edited by Preeti Singh, Ali Abas Wani, Horst-Christian Langowski.
by Singh, Preeti (Materials scientist) [editor.] | Wani, Ali Abas [editor.] | Langowski, Horst-Christian [editor.]. Material type: Book; Literary form:
Not fiction
Publisher: Boca Raton : CRC Press, [2017]Online access: Click here to view. Availability: No items available
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Advanced electronic packaging.
by Brown, William D, 1943- | Ulrich, Richard K. (Richard Kevin), 1955- | John Wiley & Sons [publisher.] | IEEE Xplore (Online service) [distributor.]. Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Online access: Abstract with links to resource Availability: No items available
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Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown.
by Ulrich, Richard Kevin, 1955- | Brown, William D, 1943- | IEEE Xplore (Online Service) [distributor.] | John Wiley & Sons [publisher.]. Edition: 2nd edMaterial type: Book; Format:
available online
Publisher: Hoboken, New Jersey : $bWiley-Interscience, c2006Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2006]Online access: Abstract with links to resource Availability: No items available
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Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kr�ohnert.
by Keser, Beth, 1971- [editor.] | Kroehnert, Steffen, 1970- [editor.] | IEEE Xplore (Online Service) [distributor.] | Wiley [publisher.]. Material type: Book; Format:
available online
Publisher: Hoboken, New Jersey, USA : John Wiley & Sons, Inc., 2019Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2019]Online access: Abstract with links to resource Availability: No items available
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Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang.
by Liu, Duixian [editor.] | Zhang, Yueping [editor.] | IEEE Xplore (Online Service) [distributor.] | Wiley [publisher.]. Edition: First edition.Material type: Book; Format:
available online
Publisher: Hoboken, New Jersey : Wiley-IEEE Press, [2020]Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2020]Online access: Abstract with links to resource Availability: No items available
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Biopolymers and biocomposites from agro-waste for packaging applications / edited by Naheed Saba, Mohammad Jawaid and Mohamed Thariq.
by Saba, Naheed | Jawaid, Mohammad | Thariq, Mohamed. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Duxford : Woodhead Publishing, 2021Online access: ScienceDirect Availability: No items available
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Bionanocomposites for food packaging applications / edited by Shakeel Ahmed.
by Ahmed, Shakeel [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Cmabridge, MA : Woodhead Publishing, 2022Online access: ScienceDirect Availability: No items available
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