Central Library catalog › Results of search for 'su:"Packaging"'

Your search returned 20 results.

		Advanced electronic packaging. by Brown, William D, 1943- \| Ulrich, Richard K. (Richard Kevin), 1955- \| John Wiley & Sons [publisher.] \| IEEE Xplore (Online service) [distributor.]. Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Online access: Abstract with links to resource Availability: No items available
		Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown. by Ulrich, Richard Kevin, 1955- \| Brown, William D, 1943- \| IEEE Xplore (Online Service) [distributor.] \| John Wiley & Sons [publisher.]. Edition: 2nd edMaterial type: Book; Format: available online Publisher: Hoboken, New Jersey : $bWiley-Interscience, c2006Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2006]Online access: Abstract with links to resource Availability: No items available
		Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang. by Liu, Duixian [editor.] \| Zhang, Yueping [editor.]. Edition: First edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey : Wiley-IEEE Press, [2020]Online access: Wiley Online Library Availability: No items available
		Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kröhnert. by Keser, Beth, 1971- [editor.] \| Kroehnert, Steffen, 1970- [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019Copyright date: ©2019Online access: Wiley Online Library Availability: No items available
		Lead-free soldering process development and reliability / edited by Jasbir Bath, Bath Consultancy LLC. by Bath, Jasbir [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2020Copyright date: ©2020Online access: Wiley Online Library Availability: No items available
		Packaging technology and engineering : pharmaceutical, medical and food applications / Dipak Kumar Sarker. by Sarker, Dipak K [author.]. Edition: First edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ : Wiley, 2020Online access: Wiley Online Library Availability: No items available
		Nanotechnology-enhanced food packaging / edited by Jyotishkumar Parameswaranpillai, Radhakrishnan E.K., Aswathy Jayakumar, Sanjay Mavinkere Rangappa, Suchart Siengchin. by Parameswaranpillai, Jyotishkumar [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Weinheim, Germany : Wiley-VCH, [2022]Online access: Wiley Online Library Availability: No items available
		Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / edited by Beth Keser, Steffen Kröhnert. by Keser, Beth, 1971- [editor.] \| Kröhnert, Steffen [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Newark : John Wiley & Sons, Incorporated, 2021Online access: Wiley Online Library Availability: No items available
		Electronic packaging science and technology / King-Ning Tu, University of California, Los Angeles, United States of America; Chih Chen, National Chiao Tung University, Hsinchu, Taiwain; Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwain. by Tu, K. N. (King-Ning), 1937- [author.] \| Chen, Chih, 1970- [author.] \| Chen, Hung-Ming [author.]. Edition: 1st edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ : Wiley, 2022Online access: Wiley Online Library Availability: No items available
		Energy Storage Systems in Electronics / editors, Tetsuya Osaka, Madhav Datta. by Datta, Madhav [editor.] \| Osaka, Tetsuya [editor.]. Edition: First edition.Material type: Book; Literary form: Not fiction Publisher: Boca Raton, FL : CRC Press, 2014Online access: Click here to view. Availability: No items available
		Chitin- and Chitosan-Based Biocomposites for Food Packaging Applications [electronic resource]. by Thomas, Sabu \| Jacob, Jissy \| Loganathan, Sravanthi. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Milton : CRC Press LLC, 2020Online access: Taylor & Francis \| OCLC metadata license agreement Availability: No items available
		Food packaging : advanced materials, technologies, and innovations / edited by Sanjay Mavinkere Rangappa, Jyotishkumar Parameswaranpillai, Senthil Muthu Kumar Thiagamani, Senthilkumar Krishnasamy, Suchart Siengchin. by Rangappa, Sanjay Mavinkere [editor.] \| Parameswaranpillai, Jyotishkumar [editor.] \| Thiagamani, Senthil Muthu Kumar [editor.] \| Krishnasamy, Senthilkumar [editor.] \| Siengchin, Suchart [editor.]. Edition: First edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Boca Raton, FL : CRC Press, 2021Copyright date: ©2021Online access: Taylor & Francis \| OCLC metadata license agreement Availability: No items available
		MEMS : fundamental technology and applications / editors, Vikas Choudhary, Krzysztof Iniewski. by Choudhary, Vikas \| Iniewski, Krzysztof. Material type: Book; Literary form: Not fiction Publisher: Boca Raton : Taylor & Francis, 2013Online access: Click here to view. Availability: No items available
		Food packaging materials : testing & quality assurance / edited by Preeti Singh, Ali Abas Wani, Horst-Christian Langowski. by Singh, Preeti (Materials scientist) [editor.] \| Wani, Ali Abas [editor.] \| Langowski, Horst-Christian [editor.]. Material type: Book; Literary form: Not fiction Publisher: Boca Raton : CRC Press, [2017]Online access: Click here to view. Availability: No items available
		Advanced electronic packaging. by Brown, William D, 1943- \| Ulrich, Richard K. (Richard Kevin), 1955- \| John Wiley & Sons [publisher.] \| IEEE Xplore (Online service) [distributor.]. Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Online access: Abstract with links to resource Availability: No items available
		Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown. by Ulrich, Richard Kevin, 1955- \| Brown, William D, 1943- \| IEEE Xplore (Online Service) [distributor.] \| John Wiley & Sons [publisher.]. Edition: 2nd edMaterial type: Book; Format: available online Publisher: Hoboken, New Jersey : $bWiley-Interscience, c2006Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2006]Online access: Abstract with links to resource Availability: No items available
		Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kr�ohnert. by Keser, Beth, 1971- [editor.] \| Kroehnert, Steffen, 1970- [editor.] \| IEEE Xplore (Online Service) [distributor.] \| Wiley [publisher.]. Material type: Book; Format: available online Publisher: Hoboken, New Jersey, USA : John Wiley & Sons, Inc., 2019Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2019]Online access: Abstract with links to resource Availability: No items available
		Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang. by Liu, Duixian [editor.] \| Zhang, Yueping [editor.] \| IEEE Xplore (Online Service) [distributor.] \| Wiley [publisher.]. Edition: First edition.Material type: Book; Format: available online Publisher: Hoboken, New Jersey : Wiley-IEEE Press, [2020]Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2020]Online access: Abstract with links to resource Availability: No items available
		Biopolymers and biocomposites from agro-waste for packaging applications / edited by Naheed Saba, Mohammad Jawaid and Mohamed Thariq. by Saba, Naheed \| Jawaid, Mohammad \| Thariq, Mohamed. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Duxford : Woodhead Publishing, 2021Online access: ScienceDirect Availability: No items available
		Bionanocomposites for food packaging applications / edited by Shakeel Ahmed. by Ahmed, Shakeel [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Cmabridge, MA : Woodhead Publishing, 2022Online access: ScienceDirect Availability: No items available

		Advanced electronic packaging. by Brown, William D, 1943- \| Ulrich, Richard K. (Richard Kevin), 1955- \| John Wiley & Sons [publisher.] \| IEEE Xplore (Online service) [distributor.]. Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Online access: Abstract with links to resource Availability: No items available
		Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown. by Ulrich, Richard Kevin, 1955- \| Brown, William D, 1943- \| IEEE Xplore (Online Service) [distributor.] \| John Wiley & Sons [publisher.]. Edition: 2nd edMaterial type: Book; Format: available online Publisher: Hoboken, New Jersey : $bWiley-Interscience, c2006Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2006]Online access: Abstract with links to resource Availability: No items available
		Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang. by Liu, Duixian [editor.] \| Zhang, Yueping [editor.]. Edition: First edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey : Wiley-IEEE Press, [2020]Online access: Wiley Online Library Availability: No items available
		Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kröhnert. by Keser, Beth, 1971- [editor.] \| Kroehnert, Steffen, 1970- [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019Copyright date: ©2019Online access: Wiley Online Library Availability: No items available
		Lead-free soldering process development and reliability / edited by Jasbir Bath, Bath Consultancy LLC. by Bath, Jasbir [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2020Copyright date: ©2020Online access: Wiley Online Library Availability: No items available
		Packaging technology and engineering : pharmaceutical, medical and food applications / Dipak Kumar Sarker. by Sarker, Dipak K [author.]. Edition: First edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ : Wiley, 2020Online access: Wiley Online Library Availability: No items available
		Nanotechnology-enhanced food packaging / edited by Jyotishkumar Parameswaranpillai, Radhakrishnan E.K., Aswathy Jayakumar, Sanjay Mavinkere Rangappa, Suchart Siengchin. by Parameswaranpillai, Jyotishkumar [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Weinheim, Germany : Wiley-VCH, [2022]Online access: Wiley Online Library Availability: No items available
		Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / edited by Beth Keser, Steffen Kröhnert. by Keser, Beth, 1971- [editor.] \| Kröhnert, Steffen [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Newark : John Wiley & Sons, Incorporated, 2021Online access: Wiley Online Library Availability: No items available
		Electronic packaging science and technology / King-Ning Tu, University of California, Los Angeles, United States of America; Chih Chen, National Chiao Tung University, Hsinchu, Taiwain; Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwain. by Tu, K. N. (King-Ning), 1937- [author.] \| Chen, Chih, 1970- [author.] \| Chen, Hung-Ming [author.]. Edition: 1st edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ : Wiley, 2022Online access: Wiley Online Library Availability: No items available
		Energy Storage Systems in Electronics / editors, Tetsuya Osaka, Madhav Datta. by Datta, Madhav [editor.] \| Osaka, Tetsuya [editor.]. Edition: First edition.Material type: Book; Literary form: Not fiction Publisher: Boca Raton, FL : CRC Press, 2014Online access: Click here to view. Availability: No items available
		Chitin- and Chitosan-Based Biocomposites for Food Packaging Applications [electronic resource]. by Thomas, Sabu \| Jacob, Jissy \| Loganathan, Sravanthi. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Milton : CRC Press LLC, 2020Online access: Taylor & Francis \| OCLC metadata license agreement Availability: No items available
		Food packaging : advanced materials, technologies, and innovations / edited by Sanjay Mavinkere Rangappa, Jyotishkumar Parameswaranpillai, Senthil Muthu Kumar Thiagamani, Senthilkumar Krishnasamy, Suchart Siengchin. by Rangappa, Sanjay Mavinkere [editor.] \| Parameswaranpillai, Jyotishkumar [editor.] \| Thiagamani, Senthil Muthu Kumar [editor.] \| Krishnasamy, Senthilkumar [editor.] \| Siengchin, Suchart [editor.]. Edition: First edition.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Boca Raton, FL : CRC Press, 2021Copyright date: ©2021Online access: Taylor & Francis \| OCLC metadata license agreement Availability: No items available
		MEMS : fundamental technology and applications / editors, Vikas Choudhary, Krzysztof Iniewski. by Choudhary, Vikas \| Iniewski, Krzysztof. Material type: Book; Literary form: Not fiction Publisher: Boca Raton : Taylor & Francis, 2013Online access: Click here to view. Availability: No items available
		Food packaging materials : testing & quality assurance / edited by Preeti Singh, Ali Abas Wani, Horst-Christian Langowski. by Singh, Preeti (Materials scientist) [editor.] \| Wani, Ali Abas [editor.] \| Langowski, Horst-Christian [editor.]. Material type: Book; Literary form: Not fiction Publisher: Boca Raton : CRC Press, [2017]Online access: Click here to view. Availability: No items available
		Advanced electronic packaging. by Brown, William D, 1943- \| Ulrich, Richard K. (Richard Kevin), 1955- \| John Wiley & Sons [publisher.] \| IEEE Xplore (Online service) [distributor.]. Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Online access: Abstract with links to resource Availability: No items available
		Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown. by Ulrich, Richard Kevin, 1955- \| Brown, William D, 1943- \| IEEE Xplore (Online Service) [distributor.] \| John Wiley & Sons [publisher.]. Edition: 2nd edMaterial type: Book; Format: available online Publisher: Hoboken, New Jersey : $bWiley-Interscience, c2006Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2006]Online access: Abstract with links to resource Availability: No items available
		Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kr�ohnert. by Keser, Beth, 1971- [editor.] \| Kroehnert, Steffen, 1970- [editor.] \| IEEE Xplore (Online Service) [distributor.] \| Wiley [publisher.]. Material type: Book; Format: available online Publisher: Hoboken, New Jersey, USA : John Wiley & Sons, Inc., 2019Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2019]Online access: Abstract with links to resource Availability: No items available
		Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang. by Liu, Duixian [editor.] \| Zhang, Yueping [editor.] \| IEEE Xplore (Online Service) [distributor.] \| Wiley [publisher.]. Edition: First edition.Material type: Book; Format: available online Publisher: Hoboken, New Jersey : Wiley-IEEE Press, [2020]Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2020]Online access: Abstract with links to resource Availability: No items available
		Biopolymers and biocomposites from agro-waste for packaging applications / edited by Naheed Saba, Mohammad Jawaid and Mohamed Thariq. by Saba, Naheed \| Jawaid, Mohammad \| Thariq, Mohamed. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Duxford : Woodhead Publishing, 2021Online access: ScienceDirect Availability: No items available
		Bionanocomposites for food packaging applications / edited by Shakeel Ahmed. by Ahmed, Shakeel [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Cmabridge, MA : Woodhead Publishing, 2022Online access: ScienceDirect Availability: No items available

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